synova lgs laser edge grinding machines

  • Water jet guided laser cutting technology | Synova

    Turnkey Systems. Synova’s state-of-the-art laser cutting machines are available in manual, semi-automatic or fully automatic versions. These high-precision cutting systems, featuring our proprietary Laser MicroJet ® technology, perform fast, accurate, omni-directional cutting with no chipping, burrs, deposition, contamination, thermal damage, material changes or mechanical …

  • Synova: Your supplier of water jet guided laser cutting ...

    About Us The Synova Story ... Aside from research, both the final assembly and testing of up to 100 machines a year are performed in Synova’s modern, 1800 square meter facility in Duillier. ... First Laser Stencil (LSS) and Edge Grinding Systems (LGS) Relocation of international headquarters to Ecublens-Lausanne, Switzerland.

  • LGS 200 A - Synova - PDF Catalogs | Technical ...

    Laser Grinding System The LGS 200 A is a fully automatic laser edge-grinding system. The LGS is able to remove the wafer edge, which contains micro-cracks from back grinding, without incurring additional damages associated with conventional cutting technologies such as ‘dry’ lasers and diamond saw blades.

  • Metal cutting systems with water jet guided laser ... - Synova

    Thanks to the versatile LMJ technology, Synova’s metal cutting machines can be used for a broad range of processes, including cutting, drilling, slicing, shaping, edge grinding, grooving, milling, trenching or engraving -depending on the particular machine and number of axes.

  • Laser machining of diamond tools - Synova

    Laser machining of diamond tools ... performance eliminates the need for grinding and results in manufacturing efficiencies. Presently, laser technologies are best suited to machining such ultra-hard materials. Synova’s patented LMJ process is ... two Synova laser cutting machines to slice such diamonds before

  • LDGS 300 A - Synova SA

    The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.

  • Metal cutting systems with water jet guided laser ... - Synova

    Thanks to the versatile LMJ technology, Synova’s metal cutting machines can be used for a broad range of processes, including cutting, drilling, slicing, shaping, edge grinding, grooving, milling, trenching or engraving -depending on the particular machine and number of axes.

  • Laser machining of diamond tools - Synova

    Laser machining of diamond tools ... performance eliminates the need for grinding and results in manufacturing efficiencies. Presently, laser technologies are best suited to machining such ultra-hard materials. Synova’s patented LMJ process is ... two Synova laser cutting machines to slice such diamonds before

  • LCS 50 - Synova SA

    The LCS 50 with 3 or 5 axes is Synova’s most compact and cost-efficient Laser MicroJet ® machine. The LCS 50 is ideal for finish-machining of diamond tools, watch components and other small work pieces that require precision cutting, drilling, grooving or slicing as well as 3D processing.

  • Machine for Laser Grinding of Wafers

    Synova ? LGS ? Laser Edge Grinding Machines. The Laser Microjet wafer edge grinding machine is suitable for grinding, drilling and slotting of wafers It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strengt. Read More

  • Laser Cutting Systems - Synova - PDF Catalogs | Technical ...

    Moreover, high axis speeds are possible, reaching 1000 mm/s. In particular, cutting speeds for thin materials (i.e., 50-um thick silicon) have topped 300mm/s running through the silicon in one pass. Laser Cutting System il i The Laser Microjet Contained within a hair-thin water jet through total internai... Open the catalog to page 2

  • Synova company News and Trends items

    The Laser Microjet® wafer edge grinding machine is suitable for grinding, drilling and slotting of wafers. ... NEW: drilling grinding machine by Synova. Posted on 2/27/2016. The LSS series of laser stencil cutting machines is especially suited for high-precision cutting of stencils and metal masks. The large working area allows the cutting of ...

  • Cutting Diamond Tools By Laser MicroJet | Drupal

    The Synova LCS 50-5 laser machining process delivers an extremely fine surface finish (Ra ≤ 0,3 micron) for PCD tools, which eliminates the need for a second grinding operation. In addition, the machine’s 5-axis capability is in a position to execute CNC programs with the high degree of precision needed for such cutting tools.

  • Laser Doping System - Synova - PDF Catalogs | Technical ...

    Thin selective emitters can be produced with a laser-based industrial process. A manual loading Laser Chemical Doping system is now available from Synova. Targeting development and test laboratories, it offers a unique blend of flexibility and freedom to tailor the Laser Chemical Doping process to one’s specific solar cell structure.

  • Laser Grinding System

    pass. Laser grinding of the wafer edge is achieved in minimal time without damage. Versatile & Modular Synova’s LGS is a flexible system, with its easy setting changes, different laser sources to meet the exact requirements of a specific application and wide range of …

  • Synova receives multiple-system orders from Korean ...

    January 31--Synova announced tool orders from a Korean organic light-emitting diode (OLED) manufacturer and a leading U.S.-based semiconductor manufacturer's Korean facility.The first order was placed for the company's Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the company's Laser Grinding System, LGS 200A, for thin wafer edge grinding.

  • Laser Grinding System

    pass. Laser grinding of the wafer edge is achieved in minimal time without damage. Versatile & Modular Synova’s LGS is a flexible system, with its easy setting changes, different laser sources to meet the exact requirements of a specific application and wide range of nozzle diameters, water pressure, etc. Change of wafer

  • Synova's success – Electronics – Case Study

    The machines on offer use the water-jet-guided laser technology (also called Laser-Microjet) for various micro-machining operations such as wafer dicing and edge grinding for the semiconductor industry, and cutting of hard materials such as CBN and PCD, PV solar cells, and thin metal masks for the electronics industries.

  • lds_200M - Synova - PDF Catalogs | Technical Documentation ...

    Fast & Accurate ® The Laser MicroJet Cold Laser Power for : Cutting, Grinding, Drilling, Grooving and Scribing Contained within a hair-thin water jet through total ® internal reflection, the Laser MicroJet beam surpasses today’s laser and water cutting technologies.

  • SYNOVA S.A. | Drupal

    Synova S.A., headquartered in Duillier, Switzerland, manufactures advanced laser cutting systems that incorporate its proprietary water jet guided laser technology (Laser MicroJet) in a true industrial CNC platform.

  • S Metal Watches EPMT-2015-english-swissphotonics

    Synova Confidential Products Laser Dicing System (LDS) Laser Edge-Grinding System (LGS) with DIT Hybrid Laser Saw (HLS) with Disco Loading system Dicing / trimming / scribing of wafers Laser Cutting System (LCS) General purpose Diamond Cutting System (DCS) Laser Drilling System with Posalux Cutting of diamonds Machines with Manufacturing Partners

  • Laser MicroJet Technology - synova

    Laser MicroJet® Technology synova.ch. ... edge grinding, grooving, scribing, milling, dicing, shaping in 3 and 5 axes, trenching, profiling and engraving. Shapes LMJ machines allow omni-directional ablation pro-cesses, making the creation of any shape possible. This

  • All Synova catalogs and technical brochures

    Search in Synova catalogs and technical brochures on DirectIndustry and find the information you need in 1 click. ... Laser Edge Grinding System. 6 Pages. lds_200M. 3 Pages. LCP_flyer. 2 Pages. Overview Applications. 18 Pages. Hybrid Laser Saw. ... Fiber laser cutting machine

  • LCP_flyer - Synova - PDF Catalogs | Technical ...

    The LCP offers radically new solutions for doping of solar cells: Laser Chemical Doping uses a laser beam to groove, if necessary, the passivation layers and a chemical jet, in which the laser beam is guided, that simultaneously introduces local doping at the surface of the silicon wafers.

  • General Specifications LCS 50 - 3 LCS 50 - 5

    3-axis machine: 2D cutting, drilling, slicing, grooving 5-axis machine: 3D shaping, cutting, drilling, slicing, edge grinding (K-land edges, single or multiple clearance angles), grooving, milling, engraving The LCS 50 is Synova’s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is

  • Precision cutting and grooving with the Laser MicroJet

    Synova SA, Switzerland Precision cutting and grooving with the Laser MicroJet. EPMT 2010 2 Outline Company – Products – Markets Laser MicroJet principle ... EPMT 2010 3 Founded: 1997 Headcount: 60 employees Company. EPMT 2010 4 Products Laser Dicing System (LDS) Laser Grinding System (LGS) Hybrid Laser Saw (HLS) w/ Disco Corp. Cutting ...

  • Synova Receives Multiple-System Orders From Korean OLED ...

    The first order was placed for Synova's Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the company's Laser Grinding System, LGS 200A, for thin-wafer edge grinding. Both orders mark Synova's penetration into the Korean market, and ultimately, the increased adoption of its Laser MicroJet® for leading-edge ...

  • Synova and Disco Hi-Tec Europe co-develop hybrid dicing ...

    Jun 14, 2007· LAUSANNE, Switzerland and MUNICH, Germany -- In a move that will greatly broaden global access to its innovative water jet-guided laser technology, Synova today revealed it has entered into a partnership with Munich-based DISCO HI-TEC EUROPE GmbH -- a subsidiary of DISCO Corporation, the leading provider of semiconductor wafer dicing, grinding ...

  • GaAs-Wafer Dicing Using the Water jet Guided Laser

    GaAs-Wafer Dicing Using the Water jet Guided Laser Delphine Perrottet, Akos Spiegel, Simone Amorosi, Bernold Richerzhagen ... (next to machine) CONCLUSIONS The Laser-Microjet is currently the most promising ... B. Richerzhagen, Laser-Edge Grinding of Thin Wafers with the Water-Jet-Guided Laser, Future Fab International 16, February 2004. ACRONYMS

  • Laser machines for cutting edge processing | Drupal

    EDM machines; EDM wire; Laser processing . Laser machines for chip breaker production; Laser machines for creating blank cuts; Laser machines for cutting edge processing; Laser marking; Marking as a service; Materials for tool production . Blanks for HSS tools; Blanks for tungsten carbide tools; CBN powder / grit; CVD diamond; Carbon wheel ...